As a typical representative of the high-precision manufacturing industry, the chip manufacturing industry makes extensive use of various automated machines to improve production efficiency and quality. Among these automatic devices, slip rings play an important role as basic electrical connection devices. JINPAT, as a leading international slip ring manufacturer, offers appropriate slip ring solutions for key processes and equipment in wafer fabrication, chip etching and packaging.

Let’s first take a look at the slip ring cases supplied by JINPAT for packaging equipment. These cases cover both very complex multi-module products and seemingly ordinary standard products. One typical example is the separate standard LPS slip ring. These slip ring products have no bearings or housings and the stator and rotor brush wires are exposed. The LIPS series standard split slip ring products support 2 A current and are designed with gold-to-gold contact points to provide mixed signal and current transfer. In precision chip packaging equipment, the most commonly used LPS split slip ring model is the LPS-12, which is responsible for 360° power transmission within the machine and is not associated with signal transmission problems.

Due to their small size, the LPS series slip rings are primarily suitable for small-sized electromechanical devices, and the chip industry is no exception. For large-scale packaging equipment, slip rings with more functions and more powerful signal and current transfer capabilities should be selected. Generally, hollow shaft slip rings and customized multi-module products are commonly used in medium to large scale electromechanical devices. The latest product developed by JINPAT, LPT000-0802-02L03A, is a multi-module slip ring integrated with gas, liquid and electricity. It integrates 8 2A current channels, 2 liquid transmission channels and 3 gas transmission channels, meeting the requirements of special liquid and gas transmission in packaging equipment.

JINPAT slip rings are widely used in the chip packaging industry, providing manufacturers with reliable electrical connections. Whether it is a small packaging machine or large-scale packaging equipment, JINPAT slip ring products meet their respective needs by providing reliable signal transmission, data acquisition and power supply. By partnering with JINPAT, chip manufacturers can obtain high-quality slip ring solutions that contribute to the development and progress of the industry.